The Mathematical Model and Novel Final Test System for Wafer-Level Packaging

To develop integrated circuit (IC) test of wafer-level packaging, the electromechanical model of microprobe testing process and the IC final test system of wafer-level packaging based on microprobe arrays are first proposed. An electromechanical model of the process of microprobe testing is derived, which is based on the analysis of the collected real-time force and electrical data using designed force sensing system, voltage measuring circuit and loading system. It is found that the contact resistance is a quartic function with respect to the loading force, and the loading force has nonlinear hysteretic damping characteristics with respect to the displacement and speed of the microprobe. The real-time contact resistance is approximately an exponential function of the damping force. Finally, the effectiveness of the proposed electromechanical model on wafer-level packaging testing using our designed new microprobe arrays testing system is confirmed. It will provide models and methods for developing IC final test of wafer-level packaging.

[1]  Lei Han,et al.  Study on a cooling system based on thermoelectric cooler for thermal management of high-power LEDs , 2011, Microelectron. Reliab..

[2]  Krishnendu Chakrabarty,et al.  3D IC test scheduling using simulated annealing , 2012, Proceedings of Technical Program of 2012 VLSI Design, Automation and Test.

[3]  Steven X. Ding,et al.  An Integrated Design Framework of Fault-Tolerant Wireless Networked Control Systems for Industrial Automatic Control Applications , 2013, IEEE Transactions on Industrial Informatics.

[4]  Changsoo Jang,et al.  Failure analysis of contact probe pins for SnPb and Sn applications , 2008, Microelectron. Reliab..

[5]  T. Shi,et al.  Enhanced photovoltaic performance and stability of carbon counter electrode based perovskite solar cells encapsulated by PDMS , 2016 .

[6]  T. Shi,et al.  A novel bottom–up copper filling of blind silicon vias in 3D electronic packaging , 2015 .

[7]  Tore Undeland,et al.  Medium-Voltage Drive for Induction Machine With Multilevel Dodecagonal Voltage Space Vectors With Symmetric Triangles , 2015, IEEE Transactions on Industrial Electronics.

[8]  Tielin Shi,et al.  A novel approach for flip chip solder joint inspection based on pulsed phase thermography , 2011 .

[9]  Vadim V. Silberschmidt,et al.  Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds , 2011 .

[10]  Yang Xia,et al.  The soft-landing features of a micro-magnetorheological fluid damper , 2015 .

[11]  Mohammed Ismail,et al.  Simplified Subspaced Regression Network for Identification of Defect Patterns in Semiconductor Wafer Maps , 2015, IEEE Transactions on Industrial Informatics.

[12]  Luca Benini,et al.  Simplifying Many-Core-Based Heterogeneous SoC Programming With Offload Directives , 2015, IEEE Transactions on Industrial Informatics.

[13]  R. B. Marcus,et al.  Thermally actuated microprobes for a new wafer probe card , 1999 .

[14]  Thomas Kreis,et al.  Application of Digital Holography for Nondestructive Testing and Metrology: A Review , 2016, IEEE Transactions on Industrial Informatics.

[15]  Junhui Li,et al.  Dynamic and Electrical Characteristics of Microprobe Testing in Microelectronics Packaging , 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[16]  Liang Cheng,et al.  State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography , 2014, IEEE Transactions on Power Electronics.

[17]  Xiangyang Zhu,et al.  Extraction of Periodic Signal Without External Reference by Time-Domain Average Scanning , 2008, IEEE Transactions on Industrial Electronics.

[18]  Can Zhou,et al.  New Applications of an Automated System for High-Power LEDs , 2016, IEEE/ASME Transactions on Mechatronics.

[19]  W. R. Mann,et al.  The leading edge of production wafer probe test technology , 2004 .

[20]  Junhui Li,et al.  Real-Time Voltage and Resistance Features in Microprobe Testing Process , 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[21]  Bijaya K. Panigrahi,et al.  Control of Wind-Diesel Microgrid Using Affine Projection-Like Algorithm , 2016, IEEE Transactions on Industrial Informatics.

[22]  Majid Ahmadi,et al.  Testing 3-D IC Through-Silicon-Vias (TSVs) by Direct Probing , 2013, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[23]  Duo Wang,et al.  Structural Design and Control of a Small-MRF Damper Under 50 N Soft-Landing Applications , 2015, IEEE Transactions on Industrial Informatics.

[24]  Rasoul Azizipanah-Abarghooee,et al.  Multiobjective Dynamic Optimal Power Flow Considering Fuzzy-Based Smart Utilization of Mobile Electric Vehicles , 2016, IEEE Transactions on Industrial Informatics.

[25]  De-Shin Liu,et al.  Application of a Genetic Algorithm to the Design Optimization of a Multilayer Probe Card for Wafer-Level Testing , 2009 .

[26]  Yong Liu,et al.  Parameter Modeling for Wafer Probe Test , 2009, IEEE Transactions on Electronics Packaging Manufacturing.

[27]  E. Rosenbaum,et al.  Comparison of FICDM and Wafer-Level CDM Test Methods , 2013, IEEE Transactions on Device and Materials Reliability.

[28]  Cezar O.R. Negrão,et al.  Curve-fitting equation for prediction of the start-up stress overshoot of an oil-based drilling fluid , 2016 .

[29]  T. Shi,et al.  Optimization of through silicon via for three-dimensional integration , 2015 .

[30]  T. Shi,et al.  Using a low-temperature carbon electrode for preparing hole-conductor-free perovskite heterojunction solar cells under high relative humidity. , 2016, Nanoscale.

[31]  Li Du,et al.  Genetic algorithms for defect detection of flip chips , 2015, Microelectron. Reliab..

[32]  Cheng-Wen Wu,et al.  SOC Test Architecture and Method for 3-D ICs , 2010, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[33]  Wen-Fung Pan,et al.  Investigation of Contact Behavior and Design of Vertical Probe for Wafer Level Probing , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.