Role of Zinc on Shear Property Evolution between Sn-0.7Cu Solder and Joints
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Fuquan Zhao | Sun Xinge | Congqian Cheng | Cong-qian Cheng | Lai Wang | Jie Zhao | Lai Wang | Gao Yanjun | Jinkai Hui | Zhongbing Luo | Jie Zhao | G. Yanjun | Jinkai Hui | Sun Xinge | Fuquan Zhao | Zhongbing Luo
[1] Kwang-Lung Lin,et al. Dissolution behavior of Cu and Ag substrates in molten solders , 2006 .
[2] Yiyu Qian,et al. Improvement of microstructure and interface structure of eutectic Sn–0.7Cu solder with small amount of Zn addition , 2005 .
[3] Xin Ma,et al. Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interface , 2003 .
[4] Y. C. Chan,et al. GROWTH KINETICS OF INTERMETALLIC COMPOUNDS IN CHIP SCALE PACKAGE SOLDER JOINT , 2001 .
[5] Xin Ma,et al. Study on reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate , 2005, 2005 6th International Conference on Electronic Packaging Technology.
[6] D. Frear,et al. Pb-free solders for flip-chip interconnects , 2001 .
[7] M. Abtew,et al. Lead-free Solders in Microelectronics , 2000 .
[8] Johan Liu,et al. Tensile properties and microstructural characterization of Sn–0.7Cu–0.4Co bulk solder alloy for electronics applications , 2008 .
[9] M. Otsuka,et al. Assessment of low-cycle fatigue life of Sn-3.5mass%Ag-X (X=Bi or Cu) alloy by strain range partitioning approach , 2001 .
[10] D. R. Frear,et al. The mechanical behavior of interconnect materials for electronic packaging , 1996 .
[11] Cong-qian Cheng,et al. Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu/Cu soldering couples , 2009 .