A leakage control system for thermal stability during burn-in test

Increase in leakage current with technology scaling has been a major problem for IC technology. This problem becomes more crucial during burn-in test where stressed voltage and temperature are applied. Due to presence of a positive feedback between major components of leakage and temperature in CMOS circuits, excessive leakage may lead to thermal runaway and yield loss during burn-in test. This paper describes a novel integrated leakage control system to ensure thermal stability during burn-in test for a wide range of ambient temperatures and process variations

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