Study on chip components assembly quality fuzzy fault diagnosis system based on solder joint shape theory

The quality of surface mount technology (SMT) product solder joint was key factor for SMT products. In this paper, for chip components, a fuzzy fault diagnosis principle of SMT products was analyzed. And the total framework of fault diagnosis system was built based on solder joint shape theory. Geometrical shape parameters which reflected chip components solder joint quality were analyzed and determined. Through building the solder joint shape prediction model, finite element analysis of thermal stress and life prediction were done with chip components solder joint, and then reasonable solder joint shape was determined. Based on fuzzy theory, fuzzy fault diagnosis was accomplished and defects of solder joint were detected. Finally, a fuzzy fault diagnosis system of chip components was developed and a case was studied to testify its correctness.

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