Fabrication of a DIC sensor for in-plane deformation measurement

A thin epoxy film with a micro speckle pattern was developed as a deformation sensor, and replicated on the surface of a sample. In order to improve the toughness of the thin epoxy film, a flexibilizer was added into the epoxy compound and the mechanical property of the thin epoxy film was analyzed. The measurement results show that the toughness of the thin film has been improved greatly, which enlarges the range of application of deformation measurement. Finally, the feasibility of application of the thin film digital image correlation (DIC) sensor was verified using a standard tensile experiment. And the interface deformation of the signal lap joint was measured by using fabrication and replication of the micro speckle pattern and micro digital image correlation. The failure mode of a single lap joint at micro-scale lengths was determined by analyzing the captured images of the micro speckle pattern.

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