Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination

Power and ground planes are required to have low impedance over a wide range of frequencies. Parallel ground and power planes in multilayer printed-circuit boards exhibit multiple resonances, which increase the impedance and also the radiation from the edge of the board. Resistive termination along the board edges reduces the resonance peaks. Simple and straightforward design expressions, simulated self and transfer impedances, as well as measured impedance plots are presented for power-ground planes.

[1]  Leonard W. Schaper,et al.  Embedded thin film resistors, capacitors and inductors in flexible polyimide films , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[2]  T. Roy,et al.  ESR and ESL of ceramic capacitor applied to decoupling applications , 1998, IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370).

[3]  Keunmyung Lee,et al.  Modeling and analysis of multichip module power supply planes , 1995 .

[4]  L.D. Smith,et al.  Developing a decoupling methodology with SPICE for multilayer printed circuit boards , 1998, 1998 IEEE EMC Symposium. International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.98CH36253).

[5]  L.D. Smith,et al.  Packaging and power distribution design considerations for a Sun Microsystems desktop workstation , 1997, Electrical Performance of Electronic Packaging.

[6]  Barry Kent Gilbert,et al.  Power distribution noise suppression using transmission line termination techniques , 1996 .

[7]  Raj Mittra,et al.  Efficient modeling of power planes in computer packages using the finite difference time domain method , 1994 .

[8]  M. Swaminathan,et al.  Importance of damping and resonance in thin-film integrated decoupling capacitor design , 1997, Electrical Performance of Electronic Packaging.

[9]  K. Carver A modal expansion theory for the microstrip antenna , 1979 .

[10]  I. Novak,et al.  Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination , 1998, IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370).

[11]  Jiayuan Fang,et al.  Effects of losses in power and ground planes in the simulation of simultaneous switching noise , 1994, Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging.

[12]  F. Olyslager,et al.  Study of the ground bounce caused by power plane resonances , 1998 .

[13]  George A. Katopis,et al.  Modeling, simulation, and measurement of mid-frequency simultaneous switching noise in computer systems , 1998 .

[14]  H. H. Wu,et al.  Accurate power supply and ground plane pair models , 1998, IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370).

[15]  Andreas C. Cangellaris,et al.  Reference plane parasitics modeling and their contribution to the power and ground path , 1994 .

[16]  K. Carver,et al.  Microstrip antenna technology , 1981 .