A thorough investigation of MOSFETs NBTI degradation

An overview of evolution of transistor parameters under negative bias temperature instability stress conditions commonly observed in p-MOSFETs in recent technologies is presented. The physical mechanisms of the degradation as well as the different defects involved have been discussed according to a systematic set of experiments with different stress conditions. According to our findings, a physical model is proposed which could be used to more accurately predict the transistor degradation. Finally, the influence of different process splits as the gate oxide nitridation, the nitrogen content, the source/drain implant and poly doping level on the NBTI degradation is investigated and discussed with our present understanding.

[1]  Eric M. Vogel,et al.  Defect generation and breakdown of ultrathin silicon dioxide induced by substrate hot-hole injection , 2001 .

[2]  J. Babcock,et al.  Dynamic recovery of negative bias temperature instability in p-type metal–oxide–semiconductor field-effect transistors , 2003 .

[3]  Eiichi Murakami,et al.  Effect of nitrogen at SiO2/Si interface on reliability issues—negative-bias-temperature instability and Fowler–Nordheim-stress degradation , 2002 .

[4]  D. Schroder,et al.  Negative bias temperature instability: Road to cross in deep submicron silicon semiconductor manufacturing , 2003 .

[5]  D. Frohman-Bentchkowsky A fully decoded 2048-bit electrically programmable FAMOS read-only memory , 1971 .

[6]  A. S. Grove,et al.  Characteristics of the Surface‐State Charge (Qss) of Thermally Oxidized Silicon , 1967 .

[7]  E. Poindexter,et al.  Characterization of Si/SiO2 interface defects by electron spin resonance , 1983 .

[8]  W.F. Clark,et al.  Improved hot-electron reliability in high-performance, multilevel-metal CMOS using deuterated barrier-nitride processing , 1999, IEEE Electron Device Letters.

[9]  Luca Selmi,et al.  On interface and oxide degradation in VLSI MOSFETs. II. Fowler-Nordheim stress regime , 2002 .

[10]  K. Hess,et al.  Reduction of hot electron degradation in metal oxide semiconductor transistors by deuterium processing , 1996 .

[11]  peixiong zhao,et al.  Reactions of hydrogen with Si-SiO/sub 2/ interfaces , 2000 .

[12]  最上 徹 最前線 2006 Symposium on VLSI Technology Report 四半世紀を超えてますます盛況 メタルゲート/歪み/DFMが活発 , 2006 .

[13]  Chenming Hu,et al.  Metal‐oxide‐semiconductor field‐effect‐transistor substrate current during Fowler–Nordheim tunneling stress and silicon dioxide reliability , 1994 .

[14]  Karl Hess,et al.  Theory of channel hot-carrier degradation in MOSFETs , 1999 .

[15]  J. W. Meredith,et al.  Microelectronics reliability , 1988, IEEE Region 5 Conference, 1988: 'Spanning the Peaks of Electrotechnology'.

[16]  D. Arnold,et al.  Impact ionization, trap creation, degradation, and breakdown in silicon dioxide films on silicon , 1993 .

[17]  J. Autran,et al.  Interfacial hardness enhancement in deuterium annealed 0.25 μm channel metal oxide semiconductor transistors , 1997 .

[18]  A. Stesmans Dissociation kinetics of hydrogen-passivated Pb defects at the (111)Si/SiO2 interface , 2000 .

[19]  E. H. Nicollian,et al.  Mechanism of negative‐bias‐temperature instability , 1991 .

[20]  T. Mogami,et al.  Bias temperature instability in scaled p/sup +/ polysilicon gate p-MOSFET's , 1999 .