Measurement of simulated active device and RF trace heating in high frequency circuit laminates

Purpose – The purpose of this paper is to quantify the effects of thermal conductivity (TC), dielectric constant and dissipation factor (DF) of circuit laminates on the temperature rise with active components and RF trace heating.Design/methodology/approach – Temperature rise measurements were made on surface mounted chip resistors (to simulate active components) at various dissipated power levels, with and without “via farms”. The RF heating temperature rise of 50 ohm microstrip transmission lines on 0.5 mm laminates was also measured by the same method.Findings – The chip resistor temperature rise correlated with the independently measured TC of the laminate materials. The use of a “via farm” substantially reduced the temperature rise in all materials, but the higher TC laminates still conferred a measurable advantage. The trace temperature rise due to RF heating correlated with both TC and DF.Research limitations/implications – It was shown that the one‐dimensional heat transfer model does not accurate...