Implementation of arithmetic primitives using truly deep submicron technology (TDST)

The invention of the transistor in 194 7 at Bell Laboratories revolutionised the electronics industry and created a powerful platform for emergence of new industries. The quest to increase the number of devices per chip over the last four decades has resulted in rapid transition from Small-Scale-Integration (SSI) and Large-Scale-Integration (LSI), through to the Very-Large-Scale-Integration (VLSI) technologies, incorporating approximately 10 to 100 million devices per chip. The next phase in this evolution is the Ultra-Large-Scale­ Integration (ULSI) aiming to realise new application domains currently not accessible to CMOS technology. Although technology is continuously evolving to produce smaller systems with minimised power dissipation, the IC industry is facing major challenges due to constraints on power density (W/cm2) and high dynamic (operating) and static (standby) power dissipation. Mobile multimedia communication and optical based technologies have rapidly become a significant area of research and development challenging a variety of technological fronts. The future emergence of 4G (4 Generation) wireless communications networks is further driving this development, requiring increasing levels of media rich content. The processing requirements for capture, conversion, compression, decompression, enhancement and display of higher quality multimedia, place heavy demands on current ULSI systems. This is also apparent for mobile applications and intelligent optical networks where silicon chip area and power dissipation become primary considerations. In addition to the requirements for very low power, compact size and real-time processing, the rapidly evolving nature of telecommunication networks means that flexible soft programmable systems capable of adaptation to support a number of different standards and/or roles become highly desirable. In order to fully realise the capabilities promised by the 4G and supporting intelligent networks, new enabling technologies are needed to facilitate the next generation of personal communications devices. Most of the current solutions to meet these challenges are based on various implementations of conventional architectures. For decades, silicon has been the main platform of computing, however it is slow, bulky, runs too hot, and is too expensive. Thus, new approaches to architectures, driving multimedia and future telecommunications systems, are needed in order to extend the life cycle of silicon technology. The emergence of Truly Deep Submicron Technology {TDST) and related 3-D interconnection technologies have provided potential alternatives from conventional architectures to 3-D system solutions, through integration of TDST, Vertical Software Mapping and Intelligent Interconnect Technology {IIT). The concept of Soft-Chip Technology (SCT) entails integration of "Soft-Processing Circuits" with "Soft-Configurable Circuits". This concept can effectively manipulate hardware primitives through vertical integration of control and data. Thus the notion of 3-D Soft-Chip emerges as a new design

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