Effect of Cu3Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects
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J. O. Suh | Ahila Krishnamoorthy | S. G. Mhaisalkar | King-Ning Tu | A. V. Vairagar | M. Y. Yan | F. Ren | K. Tu | S. Mhaisalkar | J. Suh | Fan Ren | A. Krishnamoorthy | M. Yan
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