Impact Study of Layout-Dependent Effects Toward FinFET Combinational Standard Cell Optimization

With the increased device integration density in advanced semiconductor technologies, the layout-dependent effects (LDEs) have become critical affecting both device-level and circuit-level performance. In this brief, we report an impact study of LDEs on 14-nm FinFET combinational standard cells to facilitate the process of design-technology co-optimization (DTCO). Focusing on the poly pitch, cut poly effect, oxide spacing effect, and cell height, improvement in speed and power consumption of typical 14-nm FinFET combinational standard cells has been achieved. Seven standard cell libraries are further designed and constructed based on the LDE study, enabling comprehensive applications with different performance, power and area (PPA) preference. Such DTCO and demonstrated experimental results can be attractive in future customized designs employing the enriched standard cell libraries at advanced technology nodes.

[1]  David-Wei Zhang,et al.  Suppression of Stress-Induced Defects in FinFET by Implantation and STI Co-Optimization , 2021, IEEE Transactions on Electron Devices.

[2]  Jonathan Chang,et al.  Test structures for debugging variation of critical devices caused by layout-dependent effects in FinFETs , 2018, 2018 IEEE International Conference on Microelectronic Test Structures (ICMTS).

[3]  Meng Li,et al.  Layout-dependent aging mitigation for critical path timing , 2018, 2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC).

[4]  Po-Yu Yang Effect of Gate-Line-End-Induced Stress and Its Impact on Device’s Characteristics in FinFETs , 2016, IEEE Electron Device Letters.

[5]  J. Ju,et al.  Characterization FinFET device layout dependent effect , 2016, China Semiconductor Technology International Conference.

[6]  Yao-Wen Chang,et al.  Layout-dependent-effects-aware analytical analog placement , 2015, 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC).

[7]  Guan Shyan Lin,et al.  Compact modeling solution of layout dependent effect for FinFET technology , 2015, Proceedings of the 2015 International Conference on Microelectronic Test Structures.

[8]  Yiming Li,et al.  Source/Drain Series Resistance Extraction in HKMG Multifin Bulk FinFET Devices , 2015, IEEE Transactions on Semiconductor Manufacturing.

[9]  A. Mercha,et al.  Layout-induced stress effects in 14nm & 10nm FinFETs and their impact on performance , 2013, 2013 Symposium on VLSI Circuits.

[10]  Bulusu Anand,et al.  Process induced mechanical stress aware poly-pitch optimization for enhanced circuit performance , 2012, Thirteenth International Symposium on Quality Electronic Design (ISQED).

[11]  M. Sherony,et al.  New layout dependency in high-k/Metal Gate MOSFETs , 2011, 2011 International Electron Devices Meeting.

[12]  A. De Keersgieter,et al.  On the efficiency of stress techniques in gate-last N-type bulk FinFETs , 2011, 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC).

[13]  Greg Baldwin,et al.  Layout Variation Effects in Advanced MOSFETs: STI-Induced Embedded SiGe Strain Relaxation and Dual-Stress-Liner Boundary Proximity Effect , 2010, IEEE Transactions on Electron Devices.

[14]  Yi-Ming Sheu,et al.  New Observations in LOD Effect of 45-nm P-MOSFETs With Strained SiGe Source/Drain and Dummy Gate , 2009, IEEE Transactions on Electron Devices.

[15]  S. Liu,et al.  Modeling well edge proximity effect on highly-scaled MOSFETs , 2005, Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005..

[16]  G. Bouche,et al.  Accurate modeling of trench isolation induced mechanical stress effects on MOSFET electrical performance , 2002, Digest. International Electron Devices Meeting,.

[17]  M. Rafik,et al.  Layout Dependent Effect: Impact on device performance and reliability in recent CMOS nodes , 2016, 2016 IEEE International Integrated Reliability Workshop (IIRW).

[18]  Morin Dehan,et al.  STI and eSiGe source/drain epitaxy induced stress modeling in 28 nm technology with replacement gate (RMG) process , 2013, 2013 Proceedings of the European Solid-State Device Research Conference (ESSDERC).