Memory reliability estimation degraded by TDDB using circuit-level accelerated life test
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[2] Jonathan Chang,et al. Product-level reliability estimator with budget-based reliability management in 20nm technology , 2015, 2015 IEEE International Reliability Physics Symposium.
[3] Baozhen Li,et al. Analysis of applying time-dependent clustering model to BEOL TDDB , 2014, IEEE International Interconnect Technology Conference.
[4] Kai Zhao,et al. Breakdown data generation and in-die deconvolution methodology to address BEOL and MOL dielectric breakdown challenges , 2015, Microelectron. Reliab..
[5] Ernest Y. Wu,et al. On the Weibull shape factor of intrinsic breakdown of dielectric films and its accurate experimental determination. Part I: theory, methodology, experimental techniques , 2002 .
[6] Costas J. Spanos,et al. Fundamentals of Semiconductor Manufacturing and Process Control: May/Fundamentals of Semiconductor Manufacturing and Process Control , 2006 .
[7] Sudhakar Yalamanchili,et al. Managing performance-reliability tradeoffs in multicore processors , 2015, 2015 IEEE International Reliability Physics Symposium.
[8] Xiaofeng Xu,et al. Employing optimal experimental design to optimize the accelerated life test plan for TDDB , 2015, 2015 Annual Reliability and Maintainability Symposium (RAMS).
[9] G. Groeseneken,et al. Recent trends in reliability assessment of advanced CMOS technologies , 2005, Proceedings of the 2005 International Conference on Microelectronic Test Structures, 2005. ICMTS 2005..
[10] Barry P. Linder,et al. A critical analysis of sampling-based reconstruction methodology for dielectric breakdown systems (BEOL/MOL/FEOL) , 2015, 2015 IEEE International Reliability Physics Symposium.
[11] Costas J. Spanos,et al. Fundamentals of Semiconductor Manufacturing and Process Control , 2006 .
[12] Chang-Chih Chen,et al. System-level modeling and microprocessor reliability analysis for backend wearout mechanisms , 2013, 2013 Design, Automation & Test in Europe Conference & Exhibition (DATE).