论文信息 - Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations

Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations

Thermo-elastic properties on aluminum interconnects are characterized by Scanning Joule Expansion Microscopy and complementary finite element analyses. Temperature distributions can be obtained by the correlation of the three-dimensional thermal expansion vectors and the device structure. Vertical and lateral displacements give access to thermally induced strains, which is important for advanced failure analyses on degradation processes.

[1] A. Volodin,et al. Implementation and optimization of a scanning Joule expansion microscope for the study of small conducting gold wires , 2000 .

[2] R. Meckenstock,et al. Thermal expansion imaging and finite element simulation of hot lines in high power AlGaN HEMT devices , 2004 .

[3] Stefan Dilhaire,et al. Joule expansion imaging techniques on microlectronic devices , 2007, 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).

[4] R. Heiderhoff,et al. Advanced dynamic failure analysis on interconnects by vectorized Scanning Joule Expansion microscopy , 2009, 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.

[5] R. Waser,et al. Comparison of in-plane and out-of-plane optical amplification in AFM measurements , 2005 .

[6] A. Majumdar,et al. Scanning Joule expansion microscopy at nanometer scales , 1998 .

[7] L. Balk,et al. Failure analysis of integrated devices by scanning thermal microscopy (SThM) , 1998 .