On the fabrication of thin film MICs from substrate cleaning to pattern delineation

Abstract The processing technology for fabricating thin film MICs is discussed. All the process steps starting from the ceramic substrate cleaning, the substrate metallization with NiCr-Cu-Au sputtered layers, photolithography and the chemical etching are described. The practical problems, important precautions and the optimized processing parameters for the development of reproducible MICs is presented.