Electrical reliability and interfacial adhesion of Cu(Mg) thin films for interconnect process adaptability
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Young-Bae Park | Young-Chang Joo | Yong-Hak Huh | Sang-Soo Hwang | Seol-Min Yi | Young‐Chang Joo | Young-Bae Park | Seol-Min Yi | Jung-Uk An | Jung Ryoul Yim | Y. Huh | Jung-Uk An | Sang-Soo Hwang | Jung-Ryoul Yim
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