论文信息 - Time domain analysis of via holes and shorting pins in microstrip using 3-D SCN TLM

Time domain analysis of via holes and shorting pins in microstrip using 3-D SCN TLM

The scattering parameters of microstrip via holes and shorting pins are computed using the 3-D SCN (symmetrical condensed node) TLM (transmission line matrix) method. The results agree well with the available data at low frequencies, thus demonstrating that the TLM method is a powerful tool applicable in the analysis of monolithic microwave integrated circuits of high-density and high-speed digital microwave circuits.<<ETX>>

Wolfgang J. R. Hoefer | C. Eswarappa

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