Impact of Si surface roughness on MOSFET characteristics with ultrathin HfON gate insulator formed by ECR plasma sputtering
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[1] T. Ohmi,et al. Dependence of electron channel mobility on Si-SiO/sub 2/ interface microroughness , 1991, IEEE Electron Device Letters.
[2] J. Jopling,et al. High performance 32nm logic technology featuring 2nd generation high-k + metal gate transistors , 2009, 2009 IEEE International Electron Devices Meeting (IEDM).
[3] R. Kuroda,et al. Revolutional Progress of Silicon Technologies Exhibiting Very High Speed Performance Over a 50-GHz Clock Rate , 2007, IEEE Transactions on Electron Devices.
[4] Shun'ichiro Ohmi,et al. Flattening Process of Si Surface below 1000°C Utilizing Ar/4.9%H2 Annealing and Its Effect on Ultrathin HfON Gate Insulator Formation , 2013, IEICE Trans. Electron..
[5] L. Terman. An investigation of surface states at a silicon/silicon oxide interface employing metal-oxide-silicon diodes , 1962 .
[6] R. Kuroda,et al. Atomically Flat Silicon Surface and Silicon/Insulator Interface Formation Technologies for (100) Surface Orientation Large-Diameter Wafers Introducing High Performance and Low-Noise Metal–Insulator–Silicon FETs , 2009, IEEE Transactions on Electron Devices.
[7] Tadahiro Ohmi,et al. The data analysis technique of the atomic force microscopy for the atomically flat silicon surface(Session9A: Silicon Devices IV) , 2008, SDM 2008.
[8] Takahiro Sano,et al. HfOxNy Thin-Film Formation on Three-Dimensional Si Structure Utilizing Electron Cyclotron Resonance Sputtering , 2009 .
[9] Tadahiro Ohmi,et al. Impact of Channel Direction Dependent Low Field Hole Mobility on (100) Orientation Silicon Surface , 2011 .
[10] Tetsuo Fukuda,et al. The Analysis of Bending Stress and Mechanical Property of Ultralarge Diameter Silicon Wafers at High Temperatures , 1996 .
[11] Yasuyuki Miyamoto,et al. InP/InGaAs Composite Metal–Oxide–Semiconductor Field-Effect Transistors with Regrown Source and Al2O3 Gate Dielectric Exhibiting Maximum Drain Current Exceeding 1.3 mA/µm , 2011 .
[12] Hiroshi Shirai,et al. Surface modification of silicon (111) by annealing at high temperature in hydrogen , 1996 .
[13] Yoshihiko Saito,et al. Periodic Step and Terrace Formation on Si(100) Surface during Si Epitaxial Growth by Atmospheric Chemical Vapor Deposition , 1992 .
[14] Shun'ichiro Ohmi,et al. Hafnium-nitride gate insulator formed by electron-cyclotron-resonance plasma sputtering , 2012, IEICE Electron. Express.
[15] Shun-ichiro Ohmi,et al. Potential of MISFET with HfN gate dielectric formed by ECR plasma sputtering , 2013 .
[16] Dae-Hee Han,et al. Effect of silicon surface roughness on MOSFET performance with ultra-thin HfON gate insulator formed by ECR sputtering (シリコン材料・デバイス) , 2012, SDM 2012.
[17] S. Saito,et al. Analytical quantum mechanical model for accumulation capacitance of MOS structures , 2002, IEEE Electron Device Letters.
[18] T. Iizuka,et al. Advanced electron mobility model of MOS inversion layer considering 2D-degenerate electron gas physics , 1990, International Technical Digest on Electron Devices.
[19] C. R. Helms,et al. Correlation between inversion layer mobility and surface roughness measured by AFM , 1996, IEEE Electron Device Letters.
[20] Tadahiro Ohmi,et al. Atomically Flattening Technology at 850ºC for Si(100) Surface , 2019, ECS Transactions.
[21] Yoshiaki Matsushita,et al. Precise Control of Annealed Wafer For Nanometer Devices , 2006 .