Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment
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P. Besser | A. Budiman | C. Hau-Riege | W. Baek | C. Lor | A. Huang | H. Kim | G. Neubauer | J. Pak | W. Nix
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