Effect of Sputtering Power on the Nucleation and Growth of Cu Films Deposited by Magnetron Sputtering
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Jaewon Lim | G. Choi | Y. Sohn | M. Le
[1] Yongfu Zhu,et al. Effect of negative substrate bias voltage on the nucleation and growth of Cu films during the initial stage of ion beam deposition , 2008 .
[2] Kah-Yoong Chan,et al. Atomic force microscopy (AFM) and X-ray diffraction (XRD) investigations of copper thin films prepared by dc magnetron sputtering technique , 2006, Microelectron. J..
[3] Kah-Yoong Chan,et al. Effects of substrate temperature on electrical and structural properties of copper thin films , 2006, Microelectron. J..
[4] M. Isshiki,et al. Electrical resistivity of Cu films deposited by ion beam deposition: Effects of grain size, impurities, and morphological defect , 2006 .
[5] N. G. Semaltianos,et al. Copper chemical vapour deposition on organosilane-treated SiO , 2004 .
[6] K. Uchino,et al. Diamond nucleation density as a function of ion-bombardment energy in electron cyclotron resonance plasma , 2003 .
[7] K. Mimura,et al. Thickness dependence of resistivity for Cu films deposited by ion beam deposition , 2003 .
[8] D. Hwang,et al. Effects of RF power variation on properties of ZnO thin films and electrical properties of p-n homojunction , 2003 .
[9] M. Isshiki,et al. Influence of Substrate Bias Voltage on the Properties of Cu Thin Films by Sputter Type Ion Beam Deposition , 2002 .
[10] Enric Bertran,et al. Effects of gas pressure and r.f. power on the growth and properties of magnetron sputter deposited amorphous carbon thin films , 2002 .
[11] Weng Hong Teh,et al. Study of microstructure and resistivity evolution for electroplated copper films at near-room temperature , 2001 .
[12] S. Dhingra,et al. Selective deposition of a thin copper film for metallization on silicon by the chemical bath process , 1999 .
[13] R. Vook. Electrical control of surface electromigration damage , 1997 .
[14] Shyam P. Murarka,et al. Multilevel interconnections for ULSI and GSI era , 1997 .
[15] R. Gutmann,et al. Advanced multilayer metallization schemes with copper as interconnection metal , 1993 .
[16] K. Reichelt,et al. The preparation of thin films by physical vapour deposition methods , 1990 .
[17] Kah-Yoong Chan,et al. Investigation into the influence of direct current (DC) power in the magnetron sputtering process on the copper crystallite size , 2007, Microelectron. J..
[18] K. Wasa,et al. Handbook of sputter deposition technology , 1992 .