论文信息 - The mechanical behavior of interconnect materials for electronic packaging

The mechanical behavior of interconnect materials for electronic packaging

A variety of new materials are needed for solder interconnects in electronic packages for high- and low-temperature applications. This article compares the mechanical behavior of low-temperature materials (Sn-40In-20Pb, Sn-58Bi, and a silver-loaded conductive adhesive) and high-melting-temperature solders (Sn-3.5Ag, Sn-3.4Ag-4.8Bi, and Sn-4.7 Ag-1.7Cu) to near-eutectic Sn-40Pb solder. The results indicate that there are promising materials alternatives to the traditional Sn-Pb solders in electronic interconnect applications.

D. R. Frear | D. Frear

[1] D. R. Frear,et al. Microstructural evolution during thermomechanical fatigue of 62 Sn-36 Pb-2 Ag and 60 Sn-40 Pb solder joints , 1990, 40th Conference Proceedings on Electronic Components and Technology.

[2] D. Stone,et al. Grain boundary sliding in surface mount solders during thermal cycling , 1990, 40th Conference Proceedings on Electronic Components and Technology.

[3] J. W. Morris,et al. Thermal Fatigue in Solder Joints , 1988 .

[4] D. Frear,et al. Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys , 1994 .

[5] D. R. Frear,et al. A microstructural study of the thermal fatigue failures of 60sn-40Pb solder joints , 1988 .