플립칩 본더용 가열기의 열특성 해석을 위한 수치모델

This study presents a numerical model to analyze dynamic thennal behavior of a hot chuck designed for flip-chip bonders. The hot chuck of concern is a heater which has been specifically developed for accomplishing high-speed and ultra-precision soldering. The characteristic features are radiative heat source and the heating tool made of a material of high thermal diffusivity. A physical modeling has been conducted for the network of heat transport. A simplified finite volume model is deviced to simulate time-dependent thermal behavior of the heating too on which soldering is achieved. The reliability of the proposed numerical model is verified experimentally. A series of numerical tests illustrate the usefulness of the numerical model in design analysis.