A model to predict the critical undeformed chip thickness in vibration-assisted machining of brittle materials

Abstract Vibration-assisted machining (VAM) of brittle materials has been proved to be useful in improving the machining performance by significantly increasing the critical undeformed chip thickness for ductile–brittle transition. However, until now, there does not exist any viable method or model to predict the critical undeformed chip thickness in VAM of brittle materials. The authors have already presented a specific-cutting-energy based model to predict the ductile–brittle transition in nano-machining of brittle materials. In the current study, the specific-cutting-energy based model is extended for VAM by taking into account the vibration parameters in addition to the work-material intrinsic properties, tool geometry and machining parameters in predicting the critical undeformed chip thickness. A series of cutting tests on single crystal silicon workpiece, using single crystal diamond with varying nominal cutting speeds, are conducted to verify the proposed model. It is found that the predicted results are in good agreement with the experimental results.

[1]  I. Finnie,et al.  On the machining of glass , 1980 .

[2]  Don A. Lucca,et al.  Effect of Tool Edge Geometry on Energy Dissipation in Ultraprecision Machining , 1993 .

[3]  Ming Zhou,et al.  Brittle–ductile transition in the diamond cutting of glasses with the aid of ultrasonic vibration , 2002 .

[4]  Wing Bun Lee,et al.  Diamond turning of silicon substrates in ductile-regime , 1998 .

[5]  Steven Y. Liang,et al.  Predictive modeling of transition undeformed chip thickness in ductile-regime micro-machining of single crystal brittle materials , 2009 .

[6]  M. C. Shaw.  Metal Cutting Principles , 1960 .

[7]  S. Aravindan,et al.  Machining of Hard-Brittle Materials by a Single Point Tool Under External Hydrostatic Pressure , 2005 .

[8]  B. Lawn,et al.  Brittleness as an indentation size effect , 1976 .

[9]  A. Kumar,et al.  Experimental study on ultrasonic elliptical vibration cutting of hardened steel using PCD tools , 2011 .

[10]  Kenji Inoue,et al.  Ultraprecision ductile cutting of glass by applying ultrasonic vibration , 1992 .

[11]  J. Wang,et al.  Critical Depth of Cut and Specific Cutting Energy of a Microscribing Process for Hard and Brittle Materials , 2008 .

[12]  Thomas G. Bifano,et al.  Specific grinding energy as an in-process control variable for ductile-regime grinding , 1991 .

[13]  C. Arcona,et al.  An Empirical Tool Force Model for Precision Machining , 1998 .

[14]  Eiji Shamoto,et al.  Ultraprecision diamond turning of stainless steel by applying ultrasonic vibration , 1991 .

[15]  A. Franks,et al.  Single-point diamond machining of glasses , 1989, Proceedings of the Royal Society of London. A. Mathematical and Physical Sciences.

[16]  Junichiro Kumabe,et al.  Ultrasonic superposition vibration cutting of ceramics , 1989 .

[17]  Thomas A. Dow,et al.  Review of vibration-assisted machining , 2008 .

[18]  Mahmudur Rahman,et al.  A predictive model of the critical undeformed chip thickness for ductile–brittle transition in nano-machining of brittle materials , 2013 .

[19]  Fengzhou Fang,et al.  Ultra-Precision Cutting for ZKN7 Glass , 2000 .