Effect of die design on the welding quality during solid state recycling of AA6060 chips by hot extrusion
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Wojciech Z. Misiolek | A. E. Tekkaya | A. Güzel | Andreas Jäger | N. Ben Khalifa | N. Khalifa | A. Tekkaya | W. Misiolek | A. Jäger | V. Güley | Volkan Güley | A. Güzel
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