Integrated control sub-module board for simulating multi-level modular converter (MMC) sub-module

The invention relates to a sub-module circuit board used for a dynamic simulation test for simulating a high-capacity multi-level modular converter (MMC). A digital controller on the circuit board is used for controlling a plurality of MMC sub-modules of which parameters are reduced according to an exponential method, the sub-modules are connected in series. Each MMC sub-module comprises a main circuit an insulated gate bipolar transistor (IGBT) and silicon controlled rectifier driving circuit, a capacitance and voltage sampling circuit, a circuit board isolation power supply, a control and coding-decoding chip shared by a plurality of sub-modules, and a fiber channel, wherein the main circuit a capacitor, two IGBTs which are connected vertically in series and connected with the capacitor in parallel, a bypass switch connected with the lower IGBT in parallel, and a silicon controlled rectifier which is used for protecting the IGBTs and the capacitor and connected with the lower IGBT.