Automated deep access ball bonder for MEMS packaging based on fast autofocus system

Ball bonding is one of the most commonly used form of packaging of the MEMS sensors. Batch fabrication of the conventional IC ball bonding equipment characteristics limit the flexibility of the MEMS packaging. Continuous zoom microscope as a flexible micro-vision system and the combination of manual ball bonder, automatic ball bonding system for MEMS packaging is established. By analyzing the zoom microscope imaging model, zoom microscope auto-focusing method is put forward to obtaining a clear picture of different multiples. The rough location of large-scale is achieved under low magnification, high magnification for precise positioning, using the zoom microscope continuous variable characteristics to realize a wide range of high-precision positioning. Finally, MEMS pressure sensor packaging experiments verify the system's utility.

[1]  Andrew P. Shacklock.  Multiple-view multiple-scale navigation for micro-assembly , 2004, IEEE International Conference on Robotics and Automation, 2004. Proceedings. ICRA '04. 2004.

[2]  Bradley J. Nelson,et al.  Wavelet-based autofocusing and unsupervised segmentation of microscopic images , 2003, Proceedings 2003 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2003) (Cat. No.03CH37453).

[3]  T. Ono,et al.  Resonance-free HRS MEMS package for microwave and millimeter-wave , 2005, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..

[4]  Sim Heng Ong,et al.  A stereo vision system for the inspection of IC bonding wires , 2000, Int. J. Imaging Syst. Technol..

[5]  Mag Matthijs Suijlen,et al.  Dual-mode device for in situ testing of MEMS packaging quality , 2012 .

[6]  Yasuo Marumo,et al.  Deformation analysis of Au wire bonding , 2006 .

[7]  Bradley J Nelson,et al.  Autofocusing in computer microscopy: Selecting the optimal focus algorithm , 2004, Microscopy research and technique.

[8]  Shusheng Bi,et al.  Development of global vision system for biological automatic micro-manipulation system , 2001, Proceedings 2001 ICRA. IEEE International Conference on Robotics and Automation (Cat. No.01CH37164).

[9]  Jee-Youl Ryu,et al.  A MEMS guide plate for a high temperature testing of a wafer level packaged die wafer , 2011 .

[10]  Y. F. Li,et al.  Uncertainty-driven viewpoint planning for 3D object measurements , 2003, 2003 IEEE International Conference on Robotics and Automation (Cat. No.03CH37422).

[11]  Gwi-Tae Park,et al.  Multiple magnification images based micropositioning for 3D micro assembly , 2002, 7th International Conference on Control, Automation, Robotics and Vision, 2002. ICARCV 2002..