论文信息 - The Study and Development of Modern Wave Soldering Materials for 3C Products - 字舞流文

The Study and Development of Modern Wave Soldering Materials for 3C Products

Tao Wang | Wenchao Huang | Chuntian Li | Changhua Du | Wenchao Huang | C. Du | Tao Wang | C. Li

[1] B. Liu,et al. Microstructure and Mechanical Property of (Sn-9Zn0.05Ce)xBi Solder , 2011 .

[2] Zhao Dan-na. Creep rupture and enhancement mechanism of Ag particle-enhancement composite solder joints , 2009 .

[3] F. Guo. Composite lead-free electronic solders , 2006 .

[4] K. Mohankumar,et al. Nano-particle reinforced solders for fine pitch applications , 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).