Low temperature sintering of MOD assisted Ag paste for die-attach application
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[1] K. Suganuma,et al. Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere , 2018, Materials & Design.
[2] Wendong Yang,et al. Effects of amine types on the properties of silver oxalate ink and the associated film morphology , 2018, Journal of Materials Science: Materials in Electronics.
[3] N. Lee,et al. A Brief Review on High-Temperature, Pb-Free Die-Attach Materials , 2018, Journal of Electronic Materials.
[4] K. Suganuma,et al. In situ bridging effect of Ag2O on pressureless and low-temperature sintering of micron-scale silver paste , 2017 .
[5] S. Koo,et al. The effect of silver particle size and organic stabilizers on the conductivity of silver particulate films in thermal sintering processes , 2016 .
[6] Xiaodong Li,et al. Optimizing formulations of silver organic decomposition ink for producing highly-conductive features on flexible substrates: The case study of amines , 2016 .
[7] T. Ogura,et al. Effects of Solvents in the Polyethylene Glycol Series on the Bonding of Copper Joints Using Ag2O Paste , 2013, Journal of Electronic Materials.
[8] K. Cheong,et al. A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices , 2010 .
[9] Yi Su,et al. Inkjet-printed silver conductors using silver nitrate ink and their electrical contacts with conducting polymers , 2005 .