Many emerging thermal infrared (IR) sensing applications simultaneously demand high sensitivity, large dynamic range, large pixel count, and operation at fast data rates. Among these applications are day/night persistent surveillance, border patrol and protection, aerial search and rescue, and environmental remote sensing. Such applications typically require sensor systems capable of high-quality, large-pixel-count images; furthermore, in many cases, the images must be processed rapidly to extract time-critical information. For example, real-time feature extraction that localizes a region of interest can be a key component of a high-resolution, wide-area imaging system. These requirements are driving the demand for high-capacity image processing. Another much-sought-after demand is the ability to integrate real-time, high pixel-count, image-based sensor systems into low size, weight, and power (SWaP) packages to enable the integration of the systems into a wide range of platforms. However, the development of such low-SWaP, high-performance sensor systems poses significant challenges for conventional focal plane array (FPA) technologies , which have limited data rate, dynamic range, and on-chip processing capabilities. While conventional technologies perform well in limited circumstances, scaling the technologies to meet these emerging demands is difficult and results in large, complex, expensive systems. The digital-pixel focal plane array (DFPA) was developed to address the shortfalls of conventional FPAs. The DFPA combines a commercially produced detector array with a digital-pixel readout integrated circuit (DROIC) designed by Lincoln Laboratory; this compat-Lincoln Laboratory has developed a digital-pixel focal plane array with per-pixel, 16-bit full dynamic range, analog-to-digital conversion, and real-time digital image processing capability. The technology leverages modern semiconductor processes to achieve low-power, high-component-density designs. Infrared sensors based on this innovative technology are enabling very-wide-area, high-resolution, high-sensitivity, high-update-rate imaging, as well as novel sensing modalities.
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