Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects

[1]  D. Goyal,et al.  3D Microelectronic Packaging , 2021, Springer Series in Advanced Microelectronics.

[2]  C. Handwerker,et al.  Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads , 2020 .

[3]  Paul T. Vianco,et al.  Processing and Reliability of Solder Interconnections in Stacked Packaging , 2020, 3D Microelectronic Packaging.

[4]  Mikael Olsson.  Struct , 2019, C# 8 Quick Syntax Reference.

[5]  Fengjiang Wang,et al.  Recent progress on the development of Sn–Bi based low-temperature Pb-free solders , 2019, Journal of Materials Science: Materials in Electronics.

[6]  S. P. Wang,et al.  Accurate change of carrier types within ultrathin MoTe2 field-effect transistors with the time exposed to ambient air , 2018, Journal of Materials Science.

[7]  H. Nishikawa,et al.  Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging , 2018, Journal of Alloys and Compounds.

[8]  A. Chan,et al.  Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection , 2018, Journal of Electronic Materials.

[9]  Amauri Garcia,et al.  Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys , 2017 .

[10]  Dan Ye,et al.  Microstructure and Properties of Sn-10Bi-xCu Solder Alloy/Joint , 2016, Journal of Electronic Materials.

[11]  S. Jung,et al.  Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test , 2016, Journal of Electronic Materials.

[12]  Q. Li,et al.  Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders , 2016, Journal of Electronic Materials.

[13]  H. Nishikawa,et al.  Correlation between microstructure and mechanical properties of Sn–Bi–X solders , 2016 .

[14]  S. Jung,et al.  Effects of Ag content on the reliability of LED package component with Sn–Bi–Ag solder , 2015, Journal of Materials Science: Materials in Electronics.

[15]  Feng Xue,et al.  Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder , 2015 .

[16]  C. Gourlay,et al.  The Influence of Cu on Metastable NiSn4 in Sn-3.5Ag-xCu/ENIG Joints , 2015, Journal of Electronic Materials.

[17]  S. Jung,et al.  Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions , 2015, Journal of Materials Science: Materials in Electronics.

[18]  H. Nishikawa,et al.  Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint , 2014, Journal of Electronic Materials.

[19]  Seung-Boo Jung,et al.  Effect of surface finishes on electromigration reliability in eutectic Sn–58Bi solder joints , 2014 .

[20]  F. Xue,et al.  Effect of Sb content on properties of Sn−Bi solders , 2014 .

[21]  Z. Zhang,et al.  Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate , 2012 .

[22]  C. Handwerker,et al.  Lead-Free Solder Process Development: Henshall/Lead-Free Solder Process Development , 2011 .

[23]  Sinn-wen Chen,et al.  Effects of Co Alloying and Size on Solidification and Interfacial Reactions in Sn-57 wt.%Bi-(Co)/Cu Couples , 2011 .

[24]  H. Ipser,et al.  The Ni-rich Part of the Ni-P-Sn System: Isothermal Sections , 2009 .

[25]  M. Kajihara,et al.  Solid-State Reactive Diffusion between Sn and Electroless Ni-P at 473 K , 2009 .

[26]  V. Gupta,et al.  Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes , 2008, IEEE Transactions on Components and Packaging Technologies.

[27]  C. Liu,et al.  Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects , 2008, IEEE Transactions on Components and Packaging Technologies.

[28]  Zhen Zhang,et al.  Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates , 2008 .

[29]  Y. Lei,et al.  Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy , 2008 .

[30]  David A. Hutt,et al.  Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders , 2007 .

[31]  Jiang Wang,et al.  Interfacial reaction between Sn-Bi alloy and Ni substrate , 2006 .

[32]  David A. Hutt,et al.  Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects , 2006 .

[33]  Chih-Ming Chen,et al.  Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization , 2006 .

[34]  J. Shang,et al.  Fracture of SnBi/Ni(P) interfaces , 2005 .

[35]  J. Duh,et al.  Compound formation for electroplated Ni and electroless Ni in the under-bump metallurgy with Sn-58Bi solder during aging , 2003 .

[36]  W. Boettinger,et al.  Electron backscattered diffraction and energy dispersive X-ray spectroscopy study of the phase NiSn4 , 2003 .

[37]  T. Sakai,et al.  Thermal and mechanical stability of soldering QFP with Sn-Bi-Ag lead-free alloy , 2002 .

[38]  S. Jung,et al.  Lead-Free Electronics Packaging. Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate. , 2002 .

[39]  Carol A. Handwerker,et al.  Mechanism of fillet lifting in Sn-Bi alloys , 2002 .

[40]  Y. Chan,et al.  Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn - 58Bi solders with Ni substrates , 2002 .

[41]  C. Kao,et al.  Selective interfacial reaction between Ni and eutectic BiSn lead-free solder , 2001 .

[42]  Tao Liu,et al.  Kinetics of interface reaction in 40Sn-Bi/Cu and 40Sn-Bi-2Ag/Cu systems during aging in solid state , 2000 .

[43]  J. Shim,et al.  Thermodynamic assessments of the Sn-In and Sn-Bi binary systems , 1996 .