An experimental investigation of current stressing on wafer-level chip-scale packages

We investigated the reliability of a board-level wafer-level chip-scale package (WLCSP) subjected to different accelerated current stressing conditions at a fixed ambient temperature of 125 degC. A reasonably good correlation between mean-time-to-failure of the WLCSP test vehicle and the average current density carried by a solder joint was obtained. Moreover, the trace breakage was identified as the mandatory failure mode under these current stressing conditions. In-situ observations were also conducted to further identify this particular failure mode

[1]  J. J. Lee,et al.  A study in flip-chip UBM/bump reliability with effects of SnPb solder composition , 2006, Microelectron. Reliab..

[2]  S. Brandenburg.  Electromigration Studies of Flip Chip Bump Solder Joints , 1998 .

[3]  Glenn A. Rinne.  Issues in accelerated electromigration of solder bumps , 2003, Microelectron. Reliab..

[4]  Nikhil Vishwanath Kelkar,et al.  Lead-Free and PbSn Bump Electromigration Testing , 2005 .

[5]  King-Ning Tu,et al.  Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization , 2003 .

[6]  Yi-Shao Lai,et al.  Calibration of electromigration reliability of flip-chip packages by electrothermal coupling analysis , 2006 .

[7]  Luu T. Nguyen,et al.  Mean Time To Failure in Wafer Level-CSP Packages with SnPb and SnAgCu Solder Bumps , 2005 .

[8]  J. O. Suh,et al.  Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints , 2003 .

[9]  Yi-Shao Lai,et al.  Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages , 2007, Microelectron. Reliab..

[10]  K. Tu.  Recent advances on electromigration in very-large-scale-integration of interconnects , 2003 .

[11]  Yi-Shao Lai,et al.  Cyclic bending reliability of wafer-level chip-scale packages , 2007, Microelectron. Reliab..

[12]  Yi-Shao Lai,et al.  Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages , 2007 .

[13]  Hua Ye,et al.  Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing , 2003 .

[14]  Yung-fu Chen,et al.  Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti∕Cr-Cu∕Cu and Ni(P)∕Au metallization pads , 2004 .