A CMOS-MEMS accelerometer with tri-axis sensing electrodes arrays

Abstract This study presents a single proof-mass CMOS-MEMS accelerometer with integrated tri-axis sensing electrodes arrays. The inplane finger-type and out-of-plane plate-type gap-closing sensing electrodes are employed in this study. The standard TSMC 0.35 μm 2P4M CMOS process and in-house post-CMOS process was used to implement the device. The capacitive in-plane and out-of-plane sensing gap can be defined by the minimum line-width and the thickness of CMOS process. The structure size is only 500×500 μm 2 . Measurement results show the sensitivities (non-linearities) are 2.47 mV/g (1.3%) in X-axis, 2.87 mV/g (1.4%) in Y-axis, and 3.89 mV/g (3.4%) in Z-axis. The noise flow for in-plane and out-of-plane sensing are 0.59 mg/rtHz and 0.8 mg/rtHz.

[1]  K. Sugano,et al.  A Differential Capacitive Three-Axis SOI Accelerometer using Vertical Comb Electrodes , 2007, TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference.

[2]  Weileun Fang,et al.  A monolithic 3D fully-differential CMOS accelerometer , 2008, 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems.

[3]  K. Okada,et al.  SOI micromachined 5-axis motion sensor using resonant electrostatic drive and non-resonant capacitive detection mode , 2005, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..

[4]  Weileun Fang,et al.  Design and application of a metal wet-etching post-process for the improvement of CMOS-MEMS capacitive sensors , 2009 .

[5]  Huikai Xie,et al.  A Monolithic CMOS-MEMS 3-Axis Accelerometer With a Low-Noise, Low-Power Dual-Chopper Amplifier , 2008, IEEE Sensors Journal.