论文信息 - A new efficient method for substrate-aware device-level placement (short paper) - 字舞流文

A new efficient method for substrate-aware device-level placement (short paper)

C. Lin | D. M. W. Leenaerts

[1] C. Claeys,et al. Two- and three-dimensional calculation of substrate resistance , 1988 .

[2] Michael A. Malcolm,et al. Computer methods for mathematical computations , 1977 .

[3] John K. Ousterhout,et al. Corner Stitching: A Data-Structuring Technique for VLSI Layout Tools , 1984, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[4] Welch,et al. A simple approach to modeling cross-talk in integrated circuits , 1993 .

[5] J. Catrysse. Measured distortion of the output-waveform of an integrated OPAMP due to substrate noise , 1995 .

[6] Shoichi Masui,et al. Experimental results and modeling techniques for substrate noise in mixed-signal integrated circuits , 1993 .

[7] Yoji Kajitani,et al. VLSI module placement based on rectangle-packing by the sequence-pair , 1996, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..