Copper direct bonding for 3D integration
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Pierric Gueguen | Laurent Bally | Marc Zussy | Laurent Clavelier | Maurice Rivoire | Dominique Lafond | Daniel Scevola | M. Rivoire | D. Lafond | L. Clavelier | L. Di Cioccio | M. Zussy | P. Gueguen | A. Charvet | L. Bally | Lea di Cioccio | Anne Marie Charvet | D. Scevola
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