Monitoring and Control

[1]  K. Ueno,et al.  Seed layer dependence of room-temperature recrystallization in electroplated copper films , 1999 .

[2]  M. E. Gross,et al.  RECRYSTALLIZATION KINETICS OF ELECTROPLATED CU IN DAMASCENE TRENCHES AT ROOM TEMPERATURE , 1998 .

[3]  C. Cabral,et al.  Mechanisms for microstructure evolution in electroplated copper thin films near room temperature , 1999 .

[4]  C. Ogden,et al.  A New Voltammetric Stripping Method Applied to the Determination of the Brightener Concentration in Copper Pyrophosphate Plating Baths , 1978 .

[5]  J. T. Y. Yeh Online composition analyzers , 1986 .

[6]  G. Beyer,et al.  TWO-STEP ROOM TEMPERATURE GRAIN GROWTH IN ELECTROPLATED COPPER , 1999 .

[7]  F. Walsh,et al.  Design of an ion-selective electrode analytical system for monitoring copper in electrochemical reactors , 1981 .

[8]  F. Walsh,et al.  Cyclic voltammetry at metal-electrodes , 1995 .

[9]  U. Bertocci,et al.  In Situ Stress Measurements during Copper Electrodeposition on (111)-Textured Au , 2005 .

[10]  Rolf Schumacher,et al.  The Quartz Microbalance: A Novel Approach to the In‐Situ Investigation of Interfacial Phenomena at the Solid/Liquid Junction [New Analytical Methods (40)] , 1990 .

[11]  H. Ashassi-Sorkhabi,et al.  Evaluation of initial deposition rate of electroless Ni–P layers by QCM method , 2005 .

[12]  G. Stafford,et al.  In Situ Stress Measurements During Al UPD onto (111)-Textured Au from AlCl3 – EMImCl Ionic Liquid , 2008 .

[13]  C. Lingk,et al.  Texture development of blanket electroplated copper films , 2000 .

[14]  A. Jaworski,et al.  Application of Multiblock and Hierarchical PCA and PLS Models for Analysis of AC Voltammetric Data , 2005 .

[15]  Y. Ohshita,et al.  Microstructure of Cu film sputter deposited on TiN , 2000 .

[16]  K. Maex,et al.  Self-annealing characterization of electroplated copper films , 1999 .

[17]  Thomas L. Ritzdorf,et al.  Design and modeling of equipment used in electrochemical processes for microelectronics , 2005, IBM J. Res. Dev..

[18]  T. Ritzdorf,et al.  Electrical Waveform Mediated Through-Mask Deposition of Solder Bumps for Wafer Level Packaging , 2004 .

[19]  I. Tomov,et al.  Recovery and recrystallization of electrodeposited bright copper coatings at room temperature. II. X-ray investigation of primary recrystallization , 1985 .

[20]  Michael D. Ward,et al.  Measurement of interfacial processes at electrode surfaces with the electrochemical quartz crystal microbalance , 1992 .

[21]  An in situ weighing study of the mechanism for the formation of the adsorbed oxygen monolayer at a gold electrode , 1985 .