Design and Feasibility Analysis of Microscale Bumped Channel With Supersonic Flow for Electronics Cooling
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Lin Chen | Shigenao Maruyama | Junnosuke Okajima | Atsuki Komiya | Yuka Iga | Yuya Takahashi | Wu-Shung Fu | J. Okajima | S. Maruyama | Yuya Takahashi | Lin Chen | Yuka Iga | A. Komiya | Wu-Shung Fu | Y. Iga | W. Fu
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