Debugging MBIST hard fails without bitmapping

Embedded memories modules are one of the core components in System-on-a-Chip (SoC) device. For memory built-in self-test (MBIST) failures, bitmapping tool is normally used to locate the defect location. This paper demonstrates the effectiveness in the use of dynamic photon emission microscopy (PEM) analysis as an alternative method to debug MBIST failures. We also show how an additional failure characterization step prior to fault localization, can enhance success rate and turnaround time.