Preparation and Sintering Properties of Ag27Cu2Sn Nanopaste as Die Attach Material

[1]  K. Suganuma,et al.  Simultaneous synthesis of nano and micro-Ag particles and their application as a die-attachment material , 2015, Journal of Materials Science: Materials in Electronics.

[2]  T. Zhao,et al.  Fabrication and characterization of SiC/ZrC/C ultra-thin composite fibers , 2015 .

[3]  Rong-Sheng Chen,et al.  Effect of 0.5 wt% nano-TiO2 addition into low-Ag Sn0.3Ag0.7Cu solder on the intermetallic growth with Cu substrate during isothermal aging , 2015, Journal of Materials Science: Materials in Electronics.

[4]  Hyuck-Mo Lee,et al.  Ag–Cu Bimetallic Nanoparticles with Enhanced Resistance to Oxidation: A Combined Experimental and Theoretical Study , 2014 .

[5]  Haibo Li,et al.  One-pot synthesis of Ag@Cu yolk–shell nanostructures and their application as non-enzymatic glucose biosensors , 2014 .

[6]  Philippe Godignon,et al.  A Survey of Wide Bandgap Power Semiconductor Devices , 2014, IEEE Transactions on Power Electronics.

[7]  Shear strength of copper joints prepared by low temperature sintering of silver nanoparticles , 2014, Electronic Materials Letters.

[8]  Roya Maboudian,et al.  Advances in silicon carbide science and technology at the micro- and nanoscales , 2013 .

[9]  Y. Wada,et al.  Facile synthesis of bimetallic Cu–Ag nanoparticles under microwave irradiation and their oxidation resistance , 2013, Nanotechnology.

[10]  J. Grinblat,et al.  Ag Dewetting in Cu@Ag Monodisperse Core–Shell Nanoparticles , 2013 .

[11]  Govindasamy Rajakumar,et al.  Synthesis and antimicrobial activity of copper nanoparticles , 2012 .

[12]  K. S. Siow,et al.  Mechanical properties of nano-silver joints as die attach materials , 2012 .

[13]  Pradip B. Sarawade,et al.  Synthesis of silver nanoparticles within the pores of functionalized-free silica beads: The effect of pore size and porous structure , 2012 .

[14]  M. Tsuji,et al.  Syntheses of Ag/Cu alloy and Ag/Cu alloy core Cu shell nanoparticles using a polyol method , 2010 .

[15]  M. Tsuji,et al.  Rapid synthesis of Ag@Ni core-shell nanoparticles using a microwave-polyol method , 2010 .

[16]  K. Cheong,et al.  A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices , 2010 .

[17]  Yoshiaki Morisada,et al.  A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles , 2010 .

[18]  Q. Wang,et al.  Effect of Sintering Time on the Microstructure and Properties of Inorganic Polyphosphate Bioceramics , 2010 .

[19]  A. Wu,et al.  Low Temperature Bonding of Cu Metal through Sintering of Ag Nanoparticles for High Temperature Electronic Application , 2010 .

[20]  Zhenguo Yang,et al.  Study on the friction and wear behavior of POM/Al2O3 nanocomposites , 2008 .

[21]  Tao Wang,et al.  Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection , 2007 .

[22]  M. Ge,et al.  High conductivity of isotropic conductive adhesives filled with silver nanowires , 2006 .

[23]  Magnus Willander,et al.  Silicon carbide and diamond for high temperature device applications , 2006 .

[24]  Ching-Ping Wong,et al.  Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization , 2005 .

[25]  Sinn-wen Chen,et al.  Phase equilibria of the Ag–Sn–Cu ternary system , 2004 .

[26]  U. Kattner.  Phase diagrams for lead-free solder alloys , 2002 .

[27]  W. Qi,et al.  Size effect on the cohesive energy of nanoparticle , 2002 .

[28]  Hao Wang,et al.  Influence of hot pressing sintering temperature and time on microstructure and mechanical properties of TiB2 ceramics , 2002 .

[29]  J. Glazer.  Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review , 1994 .

[30]  F. F. Wang.  Ceramic fabrication processes , 1976 .