Resilience versus Energy Tradeoffs of Emerging Device Memory Hierarchies: A Survey and Architecture Exploration

A significant shift from conventional memory stack design to novel architectures is required to reduce the processor-memory speed gap. This transformation will be realized through the deployment of the revolutionary memory technologies. The eDRAM and STT-RAM are among the list of alternative memory solutions. Each of these solutions offer various desired and unwanted characteristics. In this paper, we demonstrate multiple optimization approaches for selecting the optimal memory technology in CMP.

[1]  Tajana Simunic,et al.  MASC: Ultra-low energy multiple-access single-charge TCAM for approximate computing , 2016, 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE).

[2]  Nima Ahmadi,et al.  Service Quality Assessment via Enhanced Data-Driven MCDM Model , 2018, Advances in Service Science.

[3]  Debjit Roy,et al.  Proactive vs. reactive order-fulfillment resource allocation for sea-based logistics , 2018, Transportation Research Part E: Logistics and Transportation Review.

[4]  Norman P. Jouppi,et al.  CACTI 6.0: A Tool to Model Large Caches , 2009 .

[5]  J. Vetter,et al.  Exploring Design Space of 3 D NVM and eDRAM Caches Using DESTINY Tool , 2015 .

[6]  Mohammadali Abedini,et al.  A Novel Integrated AHP-TOPSIS Model to Deal with Big Data in Group Decision Making , 2018 .

[7]  Ronald F. Demara,et al.  Read-Tuned STT-RAM and eDRAM Cache Hierarchies for Throughput and Energy Optimization , 2018, IEEE Access.

[8]  Jun Wang,et al.  Energy-Aware Adaptive Restore Schemes for MLC STT-RAM Cache , 2017, IEEE Transactions on Computers.

[9]  Mohammadsadegh Mobin,et al.  Food product target market prioritization using MCDM approaches , 2014 .

[10]  Tajana Simunic,et al.  Image Recognition Accelerator Design Using In-Memory Processing , 2019, IEEE Micro.

[11]  C. Hwang,et al.  TOPSIS for MODM , 1994 .

[12]  Gwo-Hshiung Tzeng,et al.  Compromise solution by MCDM methods: A comparative analysis of VIKOR and TOPSIS , 2004, Eur. J. Oper. Res..

[13]  Ronald F. DeMara,et al.  Mitigating Process Variability for Non-Volatile Cache Resilience and Yield , 2020, IEEE Transactions on Emerging Topics in Computing.

[14]  Jun Wang,et al.  Bit-Upset Vulnerability Factor for eDRAM Last Level Cache immunity analysis , 2016, 2016 17th International Symposium on Quality Electronic Design (ISQED).

[15]  C. Yeh A Problem‐based Selection of Multi‐attribute Decision‐making Methods , 2002 .

[16]  Mahdi Saeedpoor,et al.  A SERVQUAL MODEL APPROACH INTEGRATED WITH FUZZY AHP AND FUZZY TOPSIS METHODOLOGIES TO RANK LIFE INSURANCE FIRMS , 2015 .

[17]  Maghsoud Amiri,et al.  An Enhanced VIKOR MCDM Model to Solve Complex and Multi-Objective Optimization Problems , 2018 .

[18]  Rasoul Haji,et al.  Ordering Policy for Vendor-Managed Inventory with Discrete Demand and Backorder , 2012 .

[19]  Vahab Vahdat,et al.  BUILDING A FLEXIBLE SIMULATION MODEL FOR MODELING MULTIPLE OUTPATIENT ORTHOPEDIC CLINICS , 2018, 2018 Winter Simulation Conference (WSC).

[20]  Tajana Simunic,et al.  FELIX: Fast and Energy-Efficient Logic in Memory , 2018, 2018 IEEE/ACM International Conference on Computer-Aided Design (ICCAD).

[21]  Cong Xu,et al.  NVSim: A Circuit-Level Performance, Energy, and Area Model for Emerging Nonvolatile Memory , 2012, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[22]  Ronald F. DeMara,et al.  Variation-immune resistive Non-Volatile Memory using self-organized sub-bank circuit designs , 2017, 2017 18th International Symposium on Quality Electronic Design (ISQED).

[23]  Alireza Afshari,et al.  Simple Additive Weighting approach to Personnel Selection problem , 2010 .

[24]  Ramtin Zand,et al.  Self-Organized Sub-bank SHE-MRAM-based LLC: An energy-efficient and variation-immune read and write architecture , 2019, Integr..

[25]  A. Driskill-Smith,et al.  Fully integrated 54nm STT-RAM with the smallest bit cell dimension for high density memory application , 2010, 2010 International Electron Devices Meeting.