Successful transferring of active transistors, rf-passive components and high density interconnect from bulk si to organic substrates
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E.B. Liao | N. Balasubramanian | L.H. Guo | L.K. Bera | D.L. Kwong | G.Q. Lo | W.Y. Loh | Q.X. Zhang | H.Y. Li | C.C. Kuo
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