Nanoelectronics Based on Carbon Nanotubes: Technological Challenges and Recent Developments

Abstract The semiconductor industry is expecting extraordinary technological challenges, so the readiness to integrate exotic materials with superior properties into microelectronic chips is increasing and new concepts are attracting more interest. This paper reviews recent research developments aimed at the design of carbon nanotube (CNT)‐based vertical interconnects. We introduce our concept for the integration of CNTs into microelectronic chips that is based on a combination of conventional technology, advanced processing methods (lithography and deposition), and self‐aligned processes.