Encapsulation of electrical contacts for suspended single‐walled carbon nanotubes by atomic layer deposition
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C. Hierold | M. Muoth | M. Mattmann | T. Helbling | Shih-Wei Lee | K. Chikkadi | Alexander Intlekofer
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C. Hierold | M. Muoth | M. Mattmann | T. Helbling | Shih-Wei Lee | K. Chikkadi | Alexander Intlekofer