论文信息 - Impact of LER on BEOL dielectric reliability: A quantitative model and experimental validation - 字舞流文

Impact of LER on BEOL dielectric reliability: A quantitative model and experimental validation

For the first time we provide a model for describing the LER induced BEOL TDDB lifetime reduction. The model was validated on 50nm ½ pitch copper damascene lines embedded into a k=2.5 low-k material.

M. Stucchi | I. Ciofi | J. Versluijs | G. Beyer | M. Stucchi | P. Roussel | Z. Tokei | I. Ciofi | L. Carbonell | J. Versluijs | A. Cockburn | L. Carbonell | G.P. Beyer | Zs. Tokei | A. Cockburn | K. Shah | Ph. Roussel | K. Shah | M. Agustin | M. Agustin

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