Semiconductor device and burn-in method

a memory cell array where a number of memory cells are stored in each row and column direction; a row decoder selecting the row of the memory cell array; and a column decoder selecting the column of the memory cell array; a data input/output pin formed on the same chip; an input/output line control circuit transmitting data inputted/outputted through the data input/output pin; a read/write control circuit supplying a signal to control the input/output of data in the memory cell array data for the input/output line; and a burn-in control circuit enabling burn-in test by supplying a burn-in signal for the row and column decoder. The burn-in test of a chip is performed after the package process.