Short-ranged structural rearrangement and enhancement of mechanical properties of organosilicate glasses induced by ultraviolet radiation
暂无分享,去创建一个
Karen Maex | Eric P. Guyer | B. Eyckens | Timo Sajavaara | Carlo Waldfried | Francesca Iacopi | Kristof Houthoofd | Pierre Jacobs | Reinhold H. Dauskardt | Youssef Travaly | F. Iacopi | R. Dauskardt | K. Maex | T. Sajavaara | Y. Travaly | P. Jacobs | K. Houthoofd | B. Eyckens | P. Grobet | Thomas Abell | David M. Gage | Pierre Grobet | E. Guyer | C. Waldfried | D. M. Gage | T. Abell | Kristof Houthoofd
[1] A. Borghesi,et al. A comparative evaluation of spin-on-glass cure by FTIR technique , 1991 .
[2] Michael Lane,et al. Adhesion and debonding of multi-layer thin film structures , 1998 .
[3] K. Minegishi,et al. The Effect of Plasma Cure Temperature on Spin‐On Glass , 1993 .
[4] F. Iacopi,et al. Challenges for structural stability of ultra-low- k -based interconnects , 2004 .
[5] A. Grill,et al. Structure of low dielectric constant to extreme low dielectric constant SiCOH films: Fourier transform infrared spectroscopy characterization , 2003 .
[6] Linards Skuja,et al. F-doped and H2-impregnated synthetic SiO2 glasses for 157 nm optics , 1999 .
[7] K. Gleason,et al. Effects of condensation reactions on the structural, mechanical, and electrical properties of plasma-deposited organosilicon thin films from octamethylcyclotetrasiloxane , 2005 .
[8] M. Loboda,et al. Properties of a ‐ SiO x : H Thin Films Deposited from Hydrogen Silsesquioxane Resins , 1998 .
[9] Florence Babonneau,et al. Synthesis of Polycarbosilane/Siloxane Hybrid Polymers and Their Pyrolytic Conversion to Silicon Oxycarbide Ceramics , 1997 .
[10] F. Iacopi,et al. On factors affecting the extraction of elastic modulus by nanoindentation of organic polymer films , 2004 .
[11] Karen Maex,et al. Factors affecting an efficient sealing of porous low-k dielectrics by physical vapor deposition Ta(N) thin films , 2002 .
[12] K. Awazu,et al. Strained Si–O–Si bonds in amorphous SiO2 materials: A family member of active centers in radio, photo, and chemical responses , 2003 .
[13] J. Rogers,et al. Optical Generation and Characterization of Acoustic Waves in Thin Films: Fundamentals and Applications , 2000 .
[14] George M. Pharr,et al. Substrate effects on nanoindentation mechanical property measurement of soft films on hard substrates , 1999 .
[15] K. Gleason,et al. Chemical bonding structure of low dielectric constant Si:O:C:H films characterized by solid-state NMR , 2005 .
[16] Michael Thorpe,et al. Continuous deformations in random networks , 1983 .
[17] M. Albrecht,et al. Materials issues with thin film hydrogen silsesquioxane low K dielectrics , 1998 .
[18] M. Lane,et al. Environmental effects on cracking and delamination of dielectric films , 2004, IEEE Transactions on Device and Materials Reliability.
[19] M. Brook. Silicon in Organic, Organometallic, and Polymer Chemistry , 1999 .
[20] E. Sleeckx,et al. Properties of porous HSQ-based films capped by plasma enhanced chemical vapor deposition dielectric layers , 2002 .
[21] S. Grigull,et al. In situ ERDA studies of ion drift processes during anodic bonding of alkali-borosilicate glass to metal , 1998 .
[22] Karen Maex,et al. Low dielectric constant materials for microelectronics , 2003 .
[23] Hideo Okabe,et al. Photochemistry of small molecules , 1978 .