Design and fabrication of electromagnetic micro-relays using the UV-LIGA technique
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[1] Wanjun Wang,et al. Microfabrication of an electromagnetic power relay using SU-8 based UV-LIGA technology , 2004 .
[2] J. Laskar,et al. A 2.4 GHz integrated CMOS power amplifier with micromachined inductors , 2001, 2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157).
[3] Bernd Loechel. Thick-layer resists for surface micromachining , 2000 .
[4] W. E. Langlois. Isothermal squeeze films , 1961 .
[5] A. Heuberger,et al. Production of separation-nozzle systems for uranium enrichment by a combination of X-ray lithography and galvanoplastics , 1982, Naturwissenschaften.
[6] Edoardo Mazza,et al. Mechanical properties of microstructures: experiments and theory , 1997, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.
[7] A. Brenner,et al. Electrodeposition of Alloys , 1964 .
[8] J. Talbot,et al. Anomalous Electrodeposition of Nickel‐Iron , 1991 .
[9] A. Maddalena. Determination of Young's Modulus of Thin Films , 1992 .
[10] Hiroshi Hosaka,et al. Electromagnetic microrelays: concepts and fundamental characteristics , 1993, [1993] Proceedings IEEE Micro Electro Mechanical Systems.
[11] M. K. Andrews,et al. A comparison of squeeze-film theory with measurements on a microstructure , 1993 .
[12] M. Stuber,et al. An Electrostatfcally Actuated Micro-relay , 1995, Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.
[13] Gabi Gruetzner,et al. Reduction of internal stress in a SU-8-like negative tone photoresist for MEMS applications by chemical modification , 2001, SPIE Advanced Lithography.
[15] M. Sakata. An electrostatic microactuator for electro-mechanical relay , 1989, IEEE Micro Electro Mechanical Systems, , Proceedings, 'An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots'.
[16] J. J. Blech. On Isothermal Squeeze Films , 1983 .
[17] Hi-Dong Chai. Electromechanical motion devices , 1998 .
[18] S. Basrour,et al. Dynamic determination of Young's modulus of electroplated nickel used in LIGA technique , 1999 .
[19] F. Parodi,et al. A silicon condenser microphone with a highly perforated backplate , 1991, TRANSDUCERS '91: 1991 International Conference on Solid-State Sensors and Actuators. Digest of Technical Papers.
[20] Wanjun Wang,et al. A rapid micro-mixer/reactor based on arrays of spatially impinging micro-jets , 2004 .
[21] John R. Rice,et al. Mechanics of Crack Tip Deformation and Extension by Fatigue , 1967 .
[22] Pascal Meyer,et al. Investigations of the development rate of irradiated PMMA Microstructures in deep X-ray lithography , 2002 .
[23] Shailesh Gadad,et al. Oxygen Incorporation during the Electrodeposition of Ni, Fe, and Ni‐Fe Alloys , 1998 .
[24] Hiroshi Hosaka,et al. Electromagnetic microrelays: Concepts and fundamental characteristics , 1994 .
[25] Wanjun Wang,et al. Using megasonic development of SU-8 to yield ultra-high aspect ratio microstructures with UV lithography , 2004 .
[26] Jian Zhang. Determination of Young’s modulus of electroplated nickel–iron (Ni/Fe) and micro-machined Si thin films by the balance method , 2002 .
[27] Thomas R. Ohnstein,et al. Electromagnetic linear actuators with inductive position sensing , 1996 .
[28] Paul M. Dentinger,et al. High aspect ratio patterning with a proximity ultraviolet source , 2002 .
[29] Thomas Edward Buchheit,et al. Microstructural and mechanical properties investigation of electrodeposited and annealed LIGA nickel structures , 2002 .
[30] G. Prentice,et al. Electrochemical Engineering Principles , 1990 .
[32] A. Buch. Fatigue Data Handbook , 1998 .
[33] Mark G. Allen,et al. Surface micromachined solenoid inductors for high frequency applications , 1997 .
[34] Theory of acoustic scattering by supported ridges at a solid-liquid interface. , 2002, Physical review. E, Statistical, nonlinear, and soft matter physics.
[35] M. Allen,et al. High O spiral-type microinductors on silicon substrates , 1999, IEEE International Magnetics Conference.
[36] A. Ugural,et al. Advanced strength and applied elasticity , 1981 .
[37] J. Kelly,et al. Electrodeposited nickel–manganese: an alloy for microsystem applications , 2004 .
[38] M. Brunet,et al. Advanced photoresist technologies for microsystems , 2001 .
[39] Soon-Bok Lee,et al. Measurement of Mechanical Properties of Electroplated Nickel Thin Film , 2004 .
[40] H. H. Richardson,et al. A Study of Fluid Squeeze-Film Damping , 1966 .
[41] K. Petersen. Dynamic micromechanics on silicon: Techniques and devices , 1978, IEEE Transactions on Electron Devices.
[42] C. Tobias,et al. A Mathematical Model for Anomalous Codeposition of Nickel‐Iron on a Rotating Disk Electrode , 1989 .
[43] Gwo-Bin Lee,et al. A new fabrication process for ultra-thick microfluidic microstructures utilizing SU-8 photoresist , 2002 .
[44] Yong-Kweon Kim,et al. UV-LIGA process for high aspect ratio structure using stress barrier and C-shaped etch hole , 2000 .
[45] Peter Vettiger,et al. High-aspect-ratio, ultrathick, negative-tone near-UV photoresist and its applications for MEMS , 1998 .
[46] Chuan Yi Tang,et al. A 2.|E|-Bit Distributed Algorithm for the Directed Euler Trail Problem , 1993, Inf. Process. Lett..
[47] A. L. Bogdanov,et al. Use of SU-8 photoresist for very high aspect ratio x-ray lithography , 2000 .
[48] H. Höppel,et al. A low-cycle fatigue life prediction model of ultrafine-grained metals , 2002 .
[49] J. Matulis,et al. On some characteristics of cathodic processes in nickel electrodeposition , 1964 .
[50] C. Cremers,et al. SU-8 as resist material for deep X-ray lithography , 2001 .
[51] M. Mcdermott,et al. Experimental Determination of K I for Hollow Rectangular Tubes Containing Corner Cracks , 1979 .
[52] Ilene J. Busch‐Vishniac. The case for magnetically driven microactuators , 1992 .
[53] Christophe Marques,et al. Manufacturing and analysis of a LIGA heat exchanger for the surface of a tube: a cooling simulation of the leading edge region of a turbine blade , 2003 .
[54] Ren-Haw Chen,et al. Development behaviours and microstructure quality of downward-development in deep x-ray lithography , 2001 .
[55] W. Menz,et al. Fully Batch Fabricated Magnetic Microactuators Using A Two Layer Liga Process , 1995, Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.
[56] Guann-Pyng Li,et al. SU-8 Processing on a Variety of Substrates , 1999 .
[57] T. Christenson,et al. Mechanical and metallographic characterization of LIGA fabricated nickel and 80%Ni-20%Fe Permalloy , 1998 .
[58] T. Harris,et al. Testing the role of metal hydrolysis in the anomalous electrodeposition of Ni-Fe alloys , 1996 .
[59] Hongrui Jiang,et al. Fabrication of high-performance on-chip suspended spiral inductors by micromachining and electroless copper plating , 2000, 2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017).
[60] J. Horkans. On the Role of Buffers and Anions in NiFe Electrodeposition , 1979 .
[61] P. Vettiger,et al. High-aspect-ratio, ultrathick, negative-tone near-uv photoresist for MEMS applications , 1997, Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots.
[62] H. Cho,et al. Measured mechanical properties of LIGA Ni structures , 2003 .
[63] F. Tseng,et al. Reduction of diffraction effect of UV exposure on SU-8 negative thick photoresist by air gap elimination , 2002 .
[64] Fan-Gang Tseng,et al. High aspect ratio ultrathick micro-stencil by JSR THB-430N negative UV photoresist , 2002 .
[65] Hongrui Jiang,et al. On-chip spiral inductors suspended over deep copper-lined cavities , 2000 .
[66] Kun Lian,et al. Improved patterning quality of SU-8 microstructures by optimizing the exposure parameters , 2000, Advanced Lithography.
[67] S. Achenbach,et al. New development strategies for high aspect ratio microstructures , 1998 .
[68] William N. Sharpe,et al. Tensile properties of LIGA nickel , 1998, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.
[69] H. Dahms,et al. The Anomalous Codeposition of Iron‐Nickel Alloys , 1965 .
[70] M. F. Chang,et al. A Surface Micromachined Miniature Switch For Telecommunications Applications With Signal Frequencies From DC Up To 4 Ghz , 1995, Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.
[71] Kevin W. Kelly,et al. Electroplated nickel mold insert for LIGA , 1995, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.