Trends in assembling of advanced IC packages

In the paper, an overview of the current trends in the development of advanced IC packages will be pre- sented. It will be shown how switching from peripheral packages (DIP, QFP) to array packages (BGA, CSP) and multichip packages (SiP, MCM) aects the assembly pro- cesses of IC and performance of electronic systems. The progress in bonding technologies for semiconductor packages will be presented too. The idea of wire bonding, ip chip and TAB assembly will be shown together with the bound- aries imposed by materials and technology. The construction of SiP packages will be explained in more detail. The paper addresses also the latest solutions in MCM packages.