Model Pulses for Performance Prediction of Digital Microelectronic Systems

Pulse-shape models are presented that furnish the tools for analyzing a number of aspects of the performance of microelectronic circuits. Model pulse shapes are provided and their properties are analyzed in detail. Applications that are covered include the replication of measured pulses that are of relevance for inter- and intra-chip interconnects and, concurrently, examples of passive circuits that generate them. The pulses are appropriate as input to time-domain electromagnetic simulation. They are also instrumental to microelectronic performance prediction protocols and measurement equipment-aspects that are of crucial importance to integrated circuit packaging.

[1]  James Oberg,et al.  Titan Calling , 2004, IEEE Spectrum.

[2]  Timothy J. Maloney.  HBM tester waveforms, equivalent circuits, and socket capacitance , 2010, Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2010.

[3]  J.L. ter Haseborg,et al.  Susceptibility of some electronic equipment to HPEM threats , 2004, IEEE Transactions on Electromagnetic Compatibility.

[4]  Paul D. Franzon,et al.  Fully integrated AC coupled interconnect using buried bumps , 2005 .

[5]  Takamaro Kikkawa,et al.  Transmission characteristics of gaussian monocycle pulses for inter-chip wireless interconnections using integrated antennas , 2005 .

[6]  J.F. Buckwalter,et al.  Predicting Microwave Digital Signal Integrity , 2009, IEEE Transactions on Advanced Packaging.

[7]  Young-Se Kwon,et al.  A 3-D X-Band T/R Module Package With an Anodized Aluminum Multilayer Substrate for Phased Array Radar Applications , 2010, IEEE Transactions on Advanced Packaging.

[8]  S. Voldman,et al.  Electrostatic Discharge Protection in the Nano-Technology - Will We be able to Provide ESD Protection in the Future? , 2006, 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings.

[9]  Guido Groeseneken,et al.  Analysis of HBM ESD testers and specifications using a fourth-order lumped element model , 1994 .

[10]  H. Schumacher,et al.  SiGe Impulse Generator for Single-Band Ultra-Wideband Applications , 2006, 2006 International SiGe Technology and Device Meeting.

[11]  Steven H. Voldman,et al.  ESD: Failure Mechanisms and Models , 2009 .

[12]  C. Nguyen,et al.  A new ultra-wideband, ultra-short monocycle pulse generator with reduced ringing , 2002 .

[13]  Ioan E. Lager,et al.  Pulsed fields EM interference analysis in digital signal wireless interconnects , 2011, 2011 41st European Microwave Conference.

[14]  Balth. van der Pol,et al.  The Fundamental Principles of Frequency Modulation , 1946 .

[15]  T.H. Hubing,et al.  The Electromagnetic Compatibility of Integrated Circuits—Past, Present, and Future , 2009, IEEE Transactions on Electromagnetic Compatibility.

[16]  Takamaro Kikkawa,et al.  A 3.5–4.5 GHz Complementary Metal–Oxide–Semiconductor Ultrawideband Receiver Frontend Low-Noise Amplifier with On-Chip Integrated Antenna for Interchip Communication , 2010 .

[17]  Y. Lamy,et al.  RF Characterization and Analytical Modelling of Through Silicon Vias and Coplanar Waveguides for 3D Integration , 2010, IEEE Transactions on Advanced Packaging.

[18]  W. E. Scott.  Operational calculus based on the two-sided Laplace integral , 1951 .

[19]  Domenico Zito,et al.  UWB CMOS Monocycle Pulse Generator , 2010, IEEE Transactions on Circuits and Systems I: Regular Papers.

[20]  Ioan E. Lager,et al.  Inter-chip and intra-chip pulsed signal transfer between transmitting and receiving loops in wireless interconnect configurations , 2010, The 40th European Microwave Conference.

[21]  R. Achar,et al.  Stability, Causality, and Passivity in Electrical Interconnect Models , 2007, IEEE Transactions on Advanced Packaging.

[22]  Qing Huo Liu,et al.  Electro-Thermo-Mechanical Characterizations of Various Wire Bonding Interconnects Illuminated by an Electromagnetic Pulse , 2010, IEEE Transactions on Advanced Packaging.

[23]  Arka Majumdar,et al.  Alignment and Performance Considerations for Capacitive, Inductive, and Optical Proximity Communication , 2010, IEEE Transactions on Advanced Packaging.

[24]  D. Widder,et al.  The Laplace Transform , 1943, The Mathematical Gazette.

[25]  B. V. D. Pol.  Discontinuous phenomena in radio communication , 1937 .

[26]  Luca Benini,et al.  Design Issues and Considerations for Low-Cost 3-D TSV IC Technology , 2010, IEEE Journal of Solid-State Circuits.

[27]  Wolfgang Porod,et al.  Nanoelectronics-Based Integrated Antennas , 2010, IMS 2012.

[28]  Peter Russer,et al.  Nanoelectronics-Based Integrate Antennas , 2010, IEEE Microwave Magazine.