Treatment of Ti-Si contact in hydronitrogen plasma
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[1] Jin Won Park,et al. Diffusion barrier performance of chemically vapor deposited TiN films prepared using tetrakis‐dimethyl‐amino titanium in the Cu/TiN/Si structure , 1996 .
[2] Evan G. Colgan,et al. Effects of oxygen in TiNx on the diffusion of Cu in Cu/TiN/Al and Cu/TiNx/Si structures , 1991 .
[3] Ki-Bum Kim,et al. Reactively sputtered TiN as a diffusion barrier between Cu and Si , 1990 .
[4] M. Wittmer. Properties and microelectronic applications of thin films of refractory metal nitrides , 1985 .
[5] James T. Luxon,et al. Integrated circuits : materials, devices, and fabrication , 1982 .