Modeling of a pair of annular through silicon vias (TSV)
暂无分享,去创建一个
[1] Makoto Motoyoshi,et al. Through-Silicon Via (TSV) , 2009, Proceedings of the IEEE.
[2] F. Ulaby. Fundamentals of applied electromagnetics , 1998 .
[3] Jun-Fa Mao,et al. A Study of On-Chip Stacked Multiloop Spiral Inductors , 2008, IEEE Transactions on Electron Devices.
[4] B. Xie,et al. Novel sequential electro-chemical and thermo-mechanical simulation methodology for annular through-silicon-via (TSV) design , 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
[5] Eby G. Friedman,et al. Interconnect-Based Design Methodologies for Three-Dimensional Integrated Circuits , 2009, Proceedings of the IEEE.
[6] Rao Tummala,et al. Electrical modeling of annular and co-axial TSVs considering MOS capacitance effects , 2009, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems.
[7] Mitsumasa Koyanagi,et al. High-Density Through Silicon Vias for 3-D LSIs , 2009, Proceedings of the IEEE.