VCSEL arrays for CMOS integrated optical interconnect systems

We report on the fabrication of two-dimensional vertical- cavity surface-emitting laser (VCSEL) arrays designed for flip-chip integration with silicon complementary metal-oxide semiconductor (CMOS) circuits. Devices emitting at 980 nm wavelength show single-mode output powers of 3 mW, modulation current efficiencies up to 10 GHz/(root)mA, and are suitable for digital data transmission at 12.5 Gb/s. The chips are incorporated into optical area interconnect system demonstrators employing plastic optical fiber bundles as waveguiding medium. Substrate removal is applied as a possible route toward the production of modules compatible to the standard 850 nm wavelength regime. Fully pretested and mechanically robust arrays for short-wavelength bottom emission are alternatively demonstrated by providing light outcoupling holes in the GaAs substrate.

[1]  R. Lytel,et al.  Optical interconnections within modern high-performance computing systems , 2000, Proceedings of the IEEE.

[2]  Takashi Kurokawa,et al.  Hybrid integration of smart pixels by using polyimide bonding: demonstration of a GaAs p-i-n photodiode/CMOS receiver , 1999 .

[3]  Ted H. Szymanski,et al.  Error and flow control in terabit intelligent optical backplanes , 1999 .

[4]  Ted Symanski.  Error and Flow Control in Terabit Intelligent Optical Backplanes , 1999, ARCS.

[5]  M. J. Goodwin,et al.  Packaging of VCSEL, MC-LED and detector 2-D arrays , 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

[6]  Detlef Kuhl,et al.  Current progress of advanced high speed parallel optical links for computer clusters and switching systems , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[7]  G. G. Stokes.  "J." , 1890, The New Yale Book of Quotations.

[8]  Jan Jonsson,et al.  Reliable vertical-cavity components for multimode data communication , 2000, Photonics West - Optoelectronic Materials and Devices.

[9]  E. Griese,et al.  3-Gb/s data transmission with GaAs VCSELs over PCB integrated polymer waveguides , 2001, IEEE Photonics Technology Letters.

[10]  H. Melchior,et al.  Demonstration of 2-D plastic optical fibre based optical interconnect between CMOS ICs , 2001, OFC 2001. Optical Fiber Communication Conference and Exhibit. Technical Digest Postconference Edition (IEEE Cat. 01CH37171).

[11]  Joni Dambre,et al.  Sense and nonsense of logic-level optical interconnect: reflections on an experiment , 2001, Optics + Photonics.

[12]  C. Zheng,et al.  ; 0 ; , 1951 .

[13]  Jörg Dr.rer.nat. Moisel,et al.  Experimental demonstration of 2.5 Gbit/s transmission with 1 m polymer optical backplane , 2001 .

[14]  H. Bartelt,et al.  Optical interconnects for neural and reconfigurable VLSI architectures , 2000, Proceedings of the IEEE.

[15]  R. Pu,et al.  Thermal resistance of VCSELs bonded to integrated circuits , 1999, IEEE Photonics Technology Letters.

[16]  Xuliang Han,et al.  An 8-Gb/s optical backplane bus based on microchannel interconnects: design, fabrication, and performance measurements , 2000, Journal of Lightwave Technology.

[17]  T. Kurokawa,et al.  Flip-chip bonded 0.85-μm bottom-emitting vertical-cavity laser array on an AlGaAs substrate , 1996, IEEE Photonics Technology Letters.

[18]  H. J. Unold,et al.  Improved VCSEL structures for 10 gigabit-Ethernet and next generation optical-integrated PC-boards , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

[19]  Stefan Lehmacher,et al.  Self-aligned coupling of optical transmitter and receiver modules to board-integrated optical multimode waveguides , 2001, Optics + Photonics.

[20]  Manfred Rode,et al.  Optical backplanes with integrated polymer waveguides , 2000 .

[21]  H. Kosaka,et al.  A two-dimensional optical parallel transmission using a vertical-cavity surface-emitting laser array module and an image fiber , 1997, IEEE Photonics Technology Letters.

[22]  Kent D. Choquette,et al.  Short wavelength bottom-emitting vertical cavity lasers fabricated using wafer bonding , 1998 .